Product Name |
Alumina(Al₂O₃) |
Aluminum Nitride(AlN) |
Sapphire |
Product Description |
Used in core parts of semiconductors due to high strength and resistance against wear and heat |
High heat conductivity and electrical insulation, as well as outstanding resistance against thermal shock and plasma |
Material with higher strength than Al₂O₃ by refining high purity Al₂O₃ |
Application |
Core parts inside the semiconductor chamber |
Heat Sink, Base board, Soaking Plate for Heater |
Parts for Etcher Process |
Product Type |
Gas Inject, Window, Ring, Arm, etc. |
Ring, Plate, Crucible |
Window, Focus Ring, Injector |
Product Name |
Silicon Pad |
YAS |
Si₃N₄ |
Product Description |
Used as heat or electrical onductive medium in etching equipment |
Better plasma characteristics than Al₂O₃ products, and used by coating YAS material on the surface of products directly exposed to plasma |
High electrical insulation and heat conductivity, and used as base for Probe Cards, Electric Power Semiconductor Modules, and Automobile Invertor Modules |
Application |
Heat conduction parts within Etcher equipment |
Semiconductor Dry Etching process |
Probe Card Guide, Electric Power Semiconductor and Automobile Invertor |
Product Type |
Thermal Pad |
Window, ESC EDGE RING |
Si₃N₄ Circuit Board |